Nordson Awards $1,000 for Best Student Paper at IMAPS Device Packaging Conference

Washington, DC (PRWEB) April 9, 2008 -- The Nordson Corporation in conjunction with the IMAPS Microelectronics Foundation presented Yang Lui with $1,000 for the Best Student Paper at the recent Device Packaging Conference. Mr. Yang's paper, "Integrated System Development for 3-D VLSI", was selected by a review team of industry and academic experts from numerous submissions.

"One of the primary goals of our Society is to encourage and support students in their endeavors toward a secure and inspired future for our industry. We are extremely pleased that Nordson has joined us in this challenge and established the Nordson Student Paper Award, stated Steve Adamson, of Asymtek, a Nordson company and President of IMAPS.

The Device Packaging Conference and Exhibition is held annually in March in the Phoenix, AZ, area. It has grown by at least 20% since its inception in 2005. IMAPS is looking forward to a successful Fifth Annual Device Packaging Conference and Exhibition in 2009.

About IMAPS

Founded in 1967, IMAPS is the leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 21 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS hosts a variety of technical workshops and conferences and professional development courses that enable these professionals to enhance their careers. In addition, the Microelectronics Foundation provides annual grants to students involved in electronic packaging disciplines.

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